

YAMAHA- YSi-SP
3D Solder Paste Inspection Machine
基本規格
| Horizontal resolution (FOV size) | 1) 25μm/12.5μm(approx.50*50mm) 2) 20μm/10μm(approx.40*40mm) 3) 15μm/7.5μm(approx.30*30mm) *All are standard selection type. |
|---|---|
| Applicable PCB | L510*W460mm to L50*W50mm(single lane spec) *No dual lane specification available |
| Height resolution | 1μm |
| Inspection items | Solder paste printing quality (volume, height, area and misalignment) |
| Power supply | Single-phase AC 200/208/220/230/240 +/- 10% |
| Air supply source | Airless specification |
| External dimension | L904*W1,080mm*H1,478mm |
| Weight | Approx. 550kg |
